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1 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com key features ? 21-27 ghz bandwidth ? 21 db nominal gain ? 2.5 db nominal noise figure ? 10 dbm nominal p1db ? bias: 3.5 v, 60 ma ? package dimensions: 4.0 x 4.0 x 1.1 mm (0.157 x 0.157 x 0.043 in) primary applications ? point-to-point radio ? point-to-multipoint radio measured data bias conditions: vd = 3.5 v, id = 60 ma 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 21 22 23 24 25 26 freq (ghz) nf (db) product description the triquint TGA4506-SM is a k-band packaged low noise amplifier. the TGA4506-SM operates from 21-27 ghz and is designed using triquint?s power phemt production process. the TGA4506-SM typically provides 2.5 db noise figure and 21 db small signal gain. the TGA4506-SM is ideally suited for point-to-point radio and point-to- multipoint radio communications. evaluation boards are available upon request. lead-free & rohs compliant. k band packaged low noise amplifier datasheet subject to change without notice
2 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com table i maximum ratings 1 / symbol parameter value notes vd drain voltage 5 v 2/ vg gate voltage range -1.5 to 0v id drain current 190 ma 2 / ? ig ? gate current 6 ma p in input continuous wave power 9 dbm p d power dissipation 0.86 w 2 / 3 / t ch operating channel temperature 200 c 4 / mounting temperature (30 seconds) 260 c t stg storage temperature -65 to 150 c 1 / these ratings represent the maximum operable values for this device. 2 / combinations of supply voltage, supply current, input power, and output power shall not exceed p d . 3/ when operated at this bias condition with a package base plate temperature of 85 c, the median life i s 1.5e+3 hrs. 4/ junction operating temperature will directly affect the device median time to failure (tm). for maximu m life, it is recommended that junction temperatures be maintained at the lowest possible levels.
3 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com table ii electrical characteristics (ta = 25 0 c nominal) parameter typical units drain voltage, vd 3.5 v drain current, id 60 ma gate voltage, vg -0.5 to 0.0 v small signal gain, s21 21 db input return loss, s11 11 db output return loss, s22 15 db noise figure, nf 2.5 db output power @ 1 db compression gain, p1db 10 dbm
4 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com table iii thermal information parameter test conditions t ch (c) jc (c/w) tm (hrs) jc thermal resistance (channel to backside of package) vd = 3.5v i d = 0.06 a pdiss = 0.21 w 113 133 1.5e+6 note: package backside on board at 85 c. median lifetime (tm) vs. channel temperature
5 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com measured data bias conditions: vd = 3.5 v, id =60 ma
6 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com measured data bias conditions: vd = 3.5 v, id =60 ma
7 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com measured data bias conditions: vd = 3.5 v, id =60 ma
8 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com package pinout diagram top view dot indicates pin 1 bottom view pin description 1, 5, 6, 10, 11, 15, 16, 20, 21 gnd 2, 4, 8, 9, 12, 14, 17, 18 n c 3r f i n p u t 19 vg1 13 r f o utput 7v d 1 tga 4506 date code lot code
9 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com mechanical drawing (bottom side) gaas mmic devices are susceptible to damage from electrostatic discharge . proper precautions should be observed during handling, assembly and test.
10 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com recommended board layout assembly all measurements were made with the pa rt soldered to 0.008 in thick ro4003 25.0 25.0 25.0 25.0 100 pf 100 pf tuning stub tuning stub 1 uf 1 uf 10 ohm 10 ohm vg ~ -0.5v adjust vg to obtain id=60ma vd = 3.5v 40.0 40.0
11 TGA4506-SM sep 2009 ? rev a triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com recommended surface mount package assembly proper esd precautions must be followed while handling packages. triquint recommends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors? recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not recommended. solder paste c an be applied using a stencil printer or dot placement. the volume of solder paste depends on pcb and component layout and should be well controlled to ensure consistent mechanical and electrical performance. compatible with high volume surface mount assembly processes using no-clean flux typical solder reflow profiles reflow profile snpb pb free ramp-up rate 3 c/sec 3 c/sec activation time and temperature 60 ? 120 sec @ 140 ? 160 c 60 ? 180 sec @ 150 ? 200 c time above melting point 60 ? 150 sec 60 ? 150 sec max peak temperature 240 c 260 c time within 5 c of peak temperature 10 ? 20 sec 10 ? 20 sec ramp-down rate 4 ? 6 c/sec 4 ? 6 c/sec ordering information part package style TGA4506-SM qfn 4x4 surface mount

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